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| Thermal Data SDIP 30 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 m molding compound 3.8 mm 0.0063W/cmC Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data SDIP 30 Rth(j-a) (C/W) 75 1) 70 die size 160x80 sq. mils mounted on a low K board (1s 1 Oz.) 80x80 sq. mils dissipating area 65 60 80x160 sq. mils dissipating area 55 0 0.5 1 1.5 dissipated power ( Watt ) 2 2.5 Zth( C/W) 2) 10 die size 160x80 sq. mils 80x80 sq. mils dissipating area mounted on a low K board (1s 1 Oz.) 0.001 0.01 0.1 1 Time (s) 10 100 1,000 2/2 |
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